Girl number 2 is well and sucking greedily. Has no patient. Want her milk instantly. Growing fatter with less wrinkle now. I like the soft hair and velvety skin. Boy, those will dissapear in no time. Number 1 is happily patting her sister right now. I am giving her 100% attention so that she don't feel threaten by the new kid on the block. So far so good. Number 1 also has flu going on for her right now but she is handling it well. I am not seeing sign of plegsm right now, which is good as she do not throw out all her food like a few months back. Trying to improve her diet with a lot of fresh fruits as she is spitting out all her vegetable with appreciable size. But luckily she is eating finely chopped vege in her porridge. She is still pretty bad with rice. Hopefully some imaginative menu will change this. Take her to Rudge's baby girl birthday later for some fun.

2011

a new year. End of a job in 5 months. Beginning to plan for a new job. This is going to be difficult. Like the previous job, this role is totally undefined. It is up to me to define what is useful for the organization. A way to look at it is i can do what i am interested in. As long as it is align to the big boss needs. So good luck and good thinking.

biomems

Article from electroiq.com

BioMEMS 2010: Microsystems Devices Driving Healthcare Applications


M2 PressWIRE
October 26, 2010

October 26, 2010 Dublin - Research and Markets (http://www.researchandmarkets.com/research/2f5149/biomems_2010_micr) has announced the addition of the "BioMEMS 2010: Microsystems Devices Driving Healthcare Applications" report to their offering. New in-vitro diagnostic systems, new therapy strategies, genetic disease treatment, targeted and intelligent drug delivery, artificial pancreas, drug discovery processes are healthcare improvements promised to future generations. Many challenges are related to miniaturization, which will probably be enabled by Semiconductor and Microsystem technologies.

The Healthcare industry faces critical technical and economic challenges to develop these new technologies. The innovation process of the future starts, by understanding the current technologies, their limits and advantages, and especially how the healthcare industry applies them. The BioMEMS 2010 report is a robust analysis of the Micro Devices with the most advances to develop solutions for vital bio-medical applications. The devices considered are: - Pressure sensors - Silicon microphones - Accelerometers - Gyroscopes - Optical MEMS and Image sensors - Microfluidic chips - Microdispensers for drug delivery - Flow meters - Infrared temperature sensors - Emerging MEMS (RFID, Strain sensors, Energy Harvesting) Also addressed are the Regulation Aspects for medical device development. The report includes a section dedicated to BioMEMS activities in China. For the past 5 years, lots of start-up biotechnology companies have launched in the Chinese market. In addition, large Biochip companies are expanding and exporting, such as CapitalBio, Health-Digital and Shanghai Biochip. MARKET The microsystem technologies market for healthcare applications will grow from $ 1.2 B in 2009 to $ 4.5 B in 2015, representing over 1 B units per year in 2015. In the Meanwhile wireless systems will exceed 50% market share. The medical home care market defined as prescribed home care medical devices is not expected to explode before 2015 but will increase by 125%. This is due to the fact that most medical instruments are lent or rented, and not purchased by the patient. Consumer, over the counter products, and sport/fitness equipment do not fall under the scope of this analysis. Who should buy the report: For IC & MEMS manufacturers, materials & equipment suppliers or system manufacturers to better understand: - The business potential - The technology status - The value chain of healthcare market - Who is doing what for strategic and marketing decision making Key Topics Covered: Content of the report Executive Summary BioMEMS 2010 Introduction Foreword Microsystems and BioMEMS definition(s) Microsystems and BioMEMS in this report Objectives of the report What has changed since 2008 The market of microsystems for Healthcare applications - Geographical distribution of the medical device market (including IVD)-2009 - The main markets considered - Microsystem devices for pharmaceutical research - Top 15 Pharmaceutical companies 2009 - Microsystem devices for IVD - Top 15 IVD companies 2009 - Medical Devices - Medical applications for microsystem technology - Micro devices in medical - Trends in medical device - Top 20 Medical Devices 2009 - Microsystem devices for Medical Home care - Micro devices in Medical Home Care - Some Home Care companies - Devices versus applications - Devices versus applications (continued) - Market forecast data 2009 -2012 - Market forecast data 2013 -2015 Market Forecast in $M - Medical MEMS market in $ - Market distribution 2009-2015 in $M - Healthcare applications 2009 & 2015 Market in $M - Market Growth 2009-2015, by application domain, in $M - Microsystem devices for healthcare applications; market 2009-2015 in $M - Microsystem devices for healthcare applications; market 2009-2015 in $M - CAGR 2009-2015 by device - Market Forecast in M$, by application - CAGR 2009-2015 by application - Evolution towards autonomous wireless systems, in M$ - Evolution towards Autonomous wireless systems, market growth in M$ BioMEMS Market Forecast in Munits - Medical MEMS market in Munits - Market distribution 2009-2015 in Munits - Healthcare applications 2009 & 2015 Market in Munits - Market Growth 2009-2015, by application domain, in Munits - Microsystem devices for healthcare applications; market 2009-2015 in Munits - Microsystem devices for healthcare applications; market 2009-2015 in Munits - Market Forecast in Munits, by application - Evolution towards autonomous wireless systems, in Munits Evolution towards Autonomous wireless systems, market growth in M$ - Applications of microsystems and BioMEMS in healthcare - Market trends - Miniaturization roadmap - Medical monitoring equipments - Kidney dialysis control - Implantable devices for monitoring - What are the components of a pacemaker? - Drug delivery and Infusion devices - Surgery equipments - Medical imaging - In Vitro Diagnostics - IVD Analysis Steps - Microsystem added value in IVD - Point of care diagnostic market - Medical Home Care Microsystems & BioMEMS Current products - Pressure sensors overview - Silicon Microphones - Accelerometers - Gyroscopes - Optical MEMS and Image Sensors - Microfluidic Chips - Microdispensers for drug delivery - Flow meters - Infrared temperature sensors - Emerging MEMS BioMEMS Activities in China - Chinese medical systems overview - Overview of BioMEMS players in China - Chinese Research Centers - Chinese Pacemaker market - Chinese Microarray & BioChip Market - Others BioMEMS:blood pressure monitors, needle-free injectors Regulation Aspects for medical device development - Quality standards and approval agencies - Requirements - The Common Technical Document - ISO 13485:2003 - Regulation Process flow development - Life Science industries in China and India - Chinese regulations aspects - Indian regulations aspects - Standards for wireless systems - Standards for wireless in healthcare Conclusion Appendix: Yole Dveloppement presentation For more information visit

3D integration

Convergence of 3D integrated packaging and 3D TSV ICs
Executive Overview
As fan-out technology production ramps and exposure to the technology grows in the industry, there is an interesting set of opportunities emerging. Although RCP technology can provide distinct advantages over both wirebond and flip chip single die packaging solutions, a closer evaluation of fan-out suggests that a more pronounced advantage is possible in the form of a multi-die, or system-in-package (SiP) solution. The RCP multi-die program is specifically designed to incorporate several of these advantages: heterogeneneous integration (die, passives, peripherals), system miniaturization, system performance, system cost, high speed in package computing, system flexibility (chip sourcing, integration), block testability, and a path to integrating with 3D TSV ICs.
Navjot Chhabra, Freescale Semiconductor, Austin, Texas, USA
Beginning in the 1990s and coming into its own in early 2000s, three dimensional (3D) through silicon via TSV IC technology has demanded a significant amount of attention. It became apparent as process and design rules continued to migrate down Moore's law that the challenges of having robust materials and chip performance were becoming a significant concern. Some of the motivations driving the development of 3D IC and TSV technologies are the increasing on-chip, high-speed signal paths as well as utilizing optimum functional blocks within the chip design. While die-to-die interconnects address many of the device functionality challenges, a number of processibility and reliability concerns remain. The hurdles to 3D integration begin with the design and modeling infrastructure and continue with clear needs for process and materials development, decreasing costs through improved yields and, ultimately, alleviating ongoing reliability concerns.
Fan-out technology
There is another technology path emerging in the industry. Similar to the evolution of front-end wafer processing, package technologies are also evolving. Historically, the motivation behind the typical packaging roadmap has been driven by the need to meet decreasing package sizes (x,y,z), lower costs, increase performance, and provide different reliability requirements and thermal and electrical compliance. However, within each packaging category the challenges of meeting certain reliability grades and functionality still remain. Similar to the ‘red brick wall' seen on the ultra-low-k material roadmap, wire bond technology is beginning to see that similar concern. As die technology keeps advancing and more functionality is required, the ability to route signals without impacting performance and cost is a great concern. While the overall die cost continues to decrease with advancing nodes, package costs are heading in the opposite direction.
In the 1980s, companies began the development of fan-out packaging technology. The idea was to eliminate the need for substrates and gold wirebond, two of the highest cost items in a package bill of materials while, at the same time, addressing some of the limitations of contemporary packaging. In 2007, Freescale introduced a fan-out technology called the redistributed chip package (RCP) built on a 300mm tool set. This specific technology is targeted at meeting the requirements listed below.
Package size reduction: ~30% size and thickness reduction vs. PBGA; package size and routability: one to six signal redistribution metal layers (RDL) and a package size ranging from 2x2mm, to as large at 40x40mm; yields: assembly yield comparable to today's packages; a cost-competitive, high productivity, large area batch process that eliminates the package substrate and eliminates gold wire bonds/C4 bumps; high-performance package with electroplated copper interconnects, reduced electrical parasitics, improved device efficiencies, higher frequency response, and active structures in routing (shielding, inductors); ultralow-k compatible (<90nm

Reit

Article from Star. Fine way to protect retirement capital.

What is REITS and how to get monthly dividend payments from it
Personal Investing - By Ooi Kok Hwa

A LOT of investors, especially senior citizens, are hoping to get consistent and regular dividend payments from stocks.
In this article, we will look into constructing an investment portfolio, which consists of real estate investment trusts (REITs), to get monthly dividend payments.
A REIT is a real estate company that pool investor funds to purchase a portfolio of properties. Normally, it has two unique characteristics: investment in income-producing properties, with almost all of its profits distributed to investors as dividends.
From the table, based on the latest stock price (as at Oct 18) and on assumption that the same dividend payments will be paid over the next 12-month period, almost all REITs will provide about 7%-8% dividend yields. Based on our observations, most of the REITs will try to pay higher dividends over the years. Hence, if the overall economy continues to recover, some REITs may pay even higher dividends for the coming few years.
Due to them only listing at the middle of this year, we have excluded CMMT and Sunreit.
As mentioned earlier, a lot of retirees would like to invest in investment assets that can provide a consistent and regular dividend income. Therefore, we think that REITs can provide a good alternative to the retirees. From the table, except for Arreit, Atrium, Axreit and Hektar, all other REITs will make dividend payments twice per year. Most of them will pay their dividends in the month of February and August. Hence, if an investor would like to receive his dividends other than the above two months, he may need to diversify their REITs into holding many types of REITs.
Based on the list of REITs in the table, we can see that, except for the month of January and April, dividend payments were being made at different months throughout the year, thus investors can receive a stream of dividend income by buying into different types of REITs.
Investors can build a REIT portfolio consisting of a few REITs which make dividend payments at different months of the year. The following is just one of selection options available for consideration.
Based on the current price dated on Oct 18, assuming that the same dividends will be paid in the next 12 months, a portfolio with AMfirst, Arreit, Atrium and Hektar can generate a dividend yield of more than 8% (see table). Besides, by buying with equal amount into these four REITs, investors can get dividend payments for almost every month, except for the month of January, April, July and October.
Nevertheless, investors need to understand that the above selections are solely based on the assumption that these REITs will reward investors with the same dividends and pay during the same month as shown in the table above.
We also understand that apart from the above four REITs, some other REITs may reward investors with even higher dividend payments.
· OoiKokHwa is an investment adviser and managing partner of MRR Consulting.

2010 investment challenge

The stock portfolio should grow by 15% at least to match the performance of PIOF under public mutual. The roller coaster ride in the last five years basically burned my earning and does not increase my holding value at all. A few bad decisions like VSI, SCICOM, MULPHA, AIRASIA and EKOWOOD has wiped out my good calls! Its a hard lesson, but a valuable lesson. Non-quality stock like Mulpha and Ekowood should be trading buy only. The time frame should be only a year and any upside or downside of certain percentage should have trigger a buy or sell call. Looking at the history of the share prices in Bursa in the pass 5 years, it is clear that only institutional stock like PBBANK, YTL, Genting and other blue chips with very strong cashflow and stable business is able to ride out recessions relatively unscathe. Their share prices will not drop too drastically, and will recover quite strongly when economy is performing reasonably well. Beware of business that has highly volatile cash flow. VSI is such an example. While it is generally a welll run company, its business nature is such that its destiny is linked to the customer's technology strength and business acumen. It is also highly affected by world economic events such as the great recession. It is also worth noting that despite some analyst brand Ekowood highly, it is such a small brand that the value is small. Its brand value does not attract buy automatically. Rather, it still probably compete on cost as its quality if exist, is virtually unknown to potential customers.

2010 is expected to be highly volatile, especially in the 2H 2010. With stimulus ending in China and US, cheap monetary flow to stimulate employment and economy will stop. With it, it is possible demand for Chinese good will drop and spawn off massive unemployment in China. That itself will jolk the world, who has came to expect China will save the world. Even more damaging, US economy will still be in an anaemic state. Lost of jobs will be closely monitored and pessimism will spread to the world. The sentiment is strong enough to push down the stock market. In fact, it is probably a good time to exit non-institutional quality of a few related companies.

Continue to build on Public Bank's share. TDM and UTDPlant will be trading buy.

2010 challenge

i have lots to blog but never really found the words for it. However, with 2010 coming, i think i will just do what most people do. Set a artificial goal for 2010. What i see for 2010 is the fact that this year will be very defining for my career. First of all, i am at a crossroad. With the current position, i feel that i am no longer building myself up technically. I need to look for a direction where i will learn new things. That is why, i think i need to be championing a roadmap for module engineering. Right now, there just isn't anyone in ATDM with this role. The absense of a champion in that sense is really handicapping ATDM as a robust organisation. We are reacting to every generation of change adhoc. I feel its a real road there. 2010, will be started with a challenge to myself to try to work into this area.